HiCOS Combi PKI Native Smart Card
SP 800-131A transition which disallows key wrapping not compliant to SP 800-38F.
When operated in FIPS mode
Security Level Exceptions
- Cryptographic Module Ports and Interfaces: Level 3
- Roles, Services, and Authentication: Level 3
- Physical Security: Level 3
- EMI/EMC: Level 3
- Design Assurance: Level 3
The HiCOS Combi PKI native smart card module is a single chip implementation of a cryptographic module that supports ISO-7816 contact interface and ISO-14443 contactless interface. The HiCOS Combi PKI native smart card module is mounted in an ID-1 class smart card body that adheres to ISO/IEC specifications for Integrated Circuit Chip (ICC) based identification cards. The module consists of the chip (ICC), the contact faceplate, the contactless faceplate, and the electronic connectors between the chip and contact pad/antenna, all contained within an epoxy substrate.
NDRNG; RSA (key wrapping; key establishment methodology provides 112 bits of encryption strength); Triple-DES (Cert. #1616, key establishment methodology provides 112-bits of encryption strength; non-compliant less than 112-bits of encryption strength)
RS46X and RS47X
HardMask: 2.3 and SoftMask: 3.5