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Cryptographic Module Validation Program CMVP

Certificate #2338

Details

Module Name
HiCOS Combi PKI Native Smart Card
Standard
FIPS 140-2
Status
Historical
 Historical Reason
SP 800-131A transition which disallows key wrapping not compliant to SP 800-38F.
Validation Dates
03/16/2015
Overall Level
2
Caveat
When operated in FIPS mode
Security Level Exceptions
  • Cryptographic Module Ports and Interfaces: Level 3
  • Roles, Services, and Authentication: Level 3
  • Physical Security: Level 3
  • EMI/EMC: Level 3
  • Design Assurance: Level 3
Module Type
Hardware
Embodiment
Single-chip
Description
The HiCOS Combi PKI native smart card module is a single chip implementation of a cryptographic module that supports ISO-7816 contact interface and ISO-14443 contactless interface. The HiCOS Combi PKI native smart card module is mounted in an ID-1 class smart card body that adheres to ISO/IEC specifications for Integrated Circuit Chip (ICC) based identification cards. The module consists of the chip (ICC), the contact faceplate, the contactless faceplate, and the electronic connectors between the chip and contact pad/antenna, all contained within an epoxy substrate.
FIPS Algorithms
DRBG Cert. #441
RSA Cert. #1393
SHS Cert. #2262
Triple-DES Cert. #1616
Other Algorithms
NDRNG; RSA (key wrapping; key establishment methodology provides 112 bits of encryption strength); Triple-DES (Cert. #1616, key establishment methodology provides 112-bits of encryption strength; non-compliant less than 112-bits of encryption strength)
Hardware Versions
RS46X and RS47X
Firmware Versions
HardMask: 2.3 and SoftMask: 3.5

Vendor

Chunghwa Telecom Co., Ltd.
12, Lane 551, Min-Tsu Road SEC.5
Yang-Mei
Taoyuan, Taiwan 326
Republic of China

Yeou-Fuh Kuan
kufo@cht.com.tw
Phone: +886-3-424-4333
Fax: +886-3-424-4129
Char-Shin Miou
mcs@cht.com.tw
Phone: +886 3 424 4381
Fax: +886-3-424-4129

Lab

CGI
NVLAP Code: 200928-0