Cryptographic Module Validation Program CMVP

Certificate #3203

Details

Module Name
Trusted Platform Module 2.0 SLB 9670
Standard
FIPS 140-2
Status
Active
Sunset Date
6/19/2023
Validation Dates
06/20/2018
Overall Level
2
Caveat
When operated in FIPS mode as specified in Security Policy Sections 1.1 and 8.1
Security Level Exceptions
  • Physical Security: Level 3
  • EMI/EMC: Level 3
Module Type
Hardware
Embodiment
Single Chip
Description
The TPM is a single chip module that provides computer manufacturers with the core components of a subsystem used to assure authenticity, integrity and confidentiality in e-commerce and internet communications within a Trusted Computing Platform. The TPM is a complete solution implementing the Trusted Platform Module Library Specification, Family "2.0", Level 00, Revision 01.16, October 2014 (ISO/IEC 11889:2015, Parts 1-4). See http://www.trustedcomputinggroup.org/ for further information on TCG and TPM.
Tested Configuration(s)
  • N/A
FIPS Algorithms
AES Cert. #5069
CKG vendor affirmed
CVL Certs. #1629 and #1630
DRBG Cert. #1886
ECDSA Cert. #1314
HMAC Cert. #3383
KAS Cert. #157
KBKDF Cert. #172
KTS AES Cert. #5069 and HMAC Cert. #3383; key establishment methodology provides between 128 and 256 bits of encryption strength
KTS vendor affirmed
RSA Cert. #2749
SHS Cert. #4129
Allowed Algorithms
NDRNG
Hardware Versions
SLB 9670 (Package PG-UQFN-32-1 or PG-VQFN-32-13)
Firmware Versions
7.83

Vendor

Infineon Technologies AG
Am Campeon 1-12
Neubiberg, BY 85579
Germany

Roland Ebrecht
Roland.Ebrecht@infineon.com
Phone: +49-821-25851-68
Fax: +49-821-25851-40
Thomas Hoffmann
Thomas.Hoffmann@infineon.com
Phone: +49-821-25851-24
Fax: +49-821-25851-40

Lab

UL VERIFICATION SERVICES INC
NVLAP Code: 100432-0