Cryptographic Module Validation Program CMVP

Certificate #3492

Details

Module Name
Trusted Platform Module 2.0 SLB 9670
Standard
FIPS 140-2
Status
Active
Sunset Date
7/15/2024
Validation Dates
07/16/2019
Overall Level
2
Caveat
When initialized and configured as specified in Sections 8.1, 9 and 10 of the Security Policy
Security Level Exceptions
  • Physical Security: Level 3
  • EMI/EMC: Level 3
Module Type
Hardware
Embodiment
Single Chip
Description
The TPM is a single chip module that provides computer manufacturers with the core components of a subsystem used to assure authenticity, integrity and confidentiality in e-commerce and internet communications within a Trusted Computing Platform. The TPM is a complete solution implementing the Trusted Platform Module Library Specification, Family "2.0", Level 00, Revision 01.38, September 2016 (ISO/IEC 11889:2015, Parts 1-4), Errata Version 1.4. See http://www.trustedcomputinggroup.org/ for further information on TCG and TPM.
Tested Configuration(s)
  • N/A
FIPS Algorithms
AES Cert. #C170
CKG vendor affirmed
CVL Cert. #C170
DRBG Cert. #C170
ECDSA Cert. #C170
HMAC Cert. #C170
KAS Cert. #C170
KAS SP 800-56Arev2, vendor affirmed
KBKDF Cert. #C170
KTS AES Cert. #C170 and HMAC Cert. #C170
KTS vendor affirmed
RSA Cert. #C170
SHS Cert. #C170
Allowed Algorithms
NDRNG
Hardware Versions
SLB 9670 (Package PG-UQFN-32-1 or PG-VQFN-32-13)
Firmware Versions
7.85

Vendor

Infineon Technologies AG
Am Campeon 1-12
Neubiberg, BY 85579
Germany

Daniel Flaschka
Daniel.Flaschka@infineon.com
Phone: +49-821-25851-47
Fax: +49-821-25851-40
Thomas Hoffmann
Thomas.Hoffmann@infineon.com
Phone: +49-821-25851-24
Fax: +49-821-25851-40

Lab

UL VERIFICATION SERVICES INC
NVLAP Code: 100432-0